Overview of the current advances in lead-free solder, with highlighting the effects ofvarious alloying elements is discussed in this paper. Also discussed is nanoparticleadditions in solder alloy, as new prospects for innovative ways to enhance solder strengthand reliability. Developing a high strength solder not containing lead is a challengingtask, and we still needs to advance our knowledge of ternary and quaternary lead-freesolder systems, from physical metallurgy. This paper discusses various alternative leadfree solders.