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An overview of corrosion analysis of solder joints
Published in American Institute of Physics Inc.
Volume: 2311
The unstoppable need and fast paced progress in the field of science and technology related trades has unlocked the door and set in new frontiers for researchers across the world, specifically those in the field of electronics. Out of many areas the one with a huge impact is the soldering technology.Ever since the birth of electronic era, soldering is seen as an important assembly having interconnectedness with technological and electronic products and this particular field is known to have a bright future over time. These solder joints have been seen as feeble associates of electronic products and the consistency of every single joint can be in charge of an electronic product's entire lifetime. To define soldering in simple terms, it encompasses the reaction of chemicals between the solder and the couple of surfaces combined together and subsequently the vitality of getting to know about the chemical reactions between the solders and bonding surfaces. Certain limitations towards the usage of hazardous substances (RoHs) that prohibits using lead-based solder because of safety and health issues have been important factors to uplift and develop new solder technology from lead-free solder. Trials are to overcome when the newly formed solder holds exactly analogous features with Sn-Pb solders. But then, these new solder alloys are said to have concerns with corrosion behavior. One of the main issues faced by a solder joint is corrosion and variety of procedures are taken up to reduce corrosion in solder joint. For this purpose, popularly SST (Salt Spray Test) is executed on the solder joints to check its corrosion effect. This study discusses the overview of corrosion in solder joints. © 2020 Author(s).
About the journal
JournalData powered by TypesetAIP Conference Proceedings
PublisherData powered by TypesetAmerican Institute of Physics Inc.