Ever since the start of the electronic age, soldering has been an important interconnecting method in microelectronic packaging. Since the 1960s, development of information technology (IT)-infrastructure has witnessed rapid advancement owing to development of novel electronic equipment. This, in turn, has led to growth and progression of industries and improved human lifestyle. Present-day electronic gadgets are highly sophisticated and comprise several components. Sn-Pb based solder alloys have always delivered excellent results, offering several amazing benefits, namely, easy handling, low melting temperature, good working condition, ductility, and exceptional wetting on Cu and its alloys. Owing to its lethal and harmful effects on health and the environment, the US Congress introduced the legislation on the limited use of Pb in 1990. Consequently, alternatives to lead free solders are being developed for last three decades. This literature review discusses the effect of Gallium, Phosphorus and Nickel addition on solder alloy microstructure and mechanical properties. © 2020 Elsevier Ltd. All rights reserved.