From the time when the electronic age started, soldering has been an significant joining technique in microelectronic packaging. Sn-Pb based solder alloys have continuously provided outstanding outcomes, offering numerous remarkable benefits, explicitly, easy handling, little melting temperature, decent operating environment, ductility, and extraordinary wetting on Cu and its alloys. Because of its lethal and dangerous effects on health and the ecosystem, the US Congress initiated the legislation on the limited use of Pb in 1990. Subsequently, substitutes to lead-free solders are being developed for the last three decades. Sn-0.7Cu is a cost-effective plumbing alloy having a high melting temperature and demonstrates a modest wetting that seems fairly adequate for numerous applications. In this study, lead-free Sn-0.7Cu solder joints on Cu Substrate were analysed. Mechanical properties such as tensile strength, bending/flexural strength, and microhardness were studied. Salt spray test (SST) was used for understanding the effect of corrosion on the mechanical response of commercial and Sn-0.7Cu CSI solder joints. Outcomes of the study confirmed that after corrosion, tensile strength, bending strength and microhardness for CSI solder joints reduced in all the cases. © 2021 Elsevier Ltd. All rights reserved.