Development of proper ways for thermal management of the electronic equipments is very essential due to miniaturization with semiconductor technology. Various active and passive cooling techniques can be used. Pin fin heat sinks are passive techniques. In this work, an experimental investigations are carried out for Elliptical pin fin heat sinks with uniform cross section with horizontal and vertical orientation also in line and staggered arrangements are considred. Various pitches considered are Transeverse pitch, S T =21.5mm, 43mm, 43mm, 86mm and Longitudinal pitch S L=22mm, 44mm, 22mm, 22mm for 1 st inline, 2 nd inline, 1 st staggered, 2 nd staggered arrangements respectively. The results were oobtained for two heights(i.e. at 75mm and 50mm) of pin fins. Velocities considered were close to 0.2m/s, 0.4m/s, 1.2m/s, 2.2m/s. From experimental investigations carried out we can conclude that the percentage heat transfer (i.e. Nusselts number) is more in case of the 1 st inline compared to all other arrangements. Heat transfer is more by 57.73% compared to the 2 nd Inline with horizontally mounted pin fins. For natural convection good results are observed for 2 nd Inline arrangement and for 1 st inline arrangement the heat transfer coefficient is very less compared to other arrangements at 75mm height and is 8.5308 W/m 2 K. © Research India Publications.