This paper mainly discusses an analysis at its very initial condition by taking into account the heat that has beentransferred from micro pin-fins. Under natural convection condition, a performance analysis of thermal propertiesof arrays of plate as well as pin type of micro-fins is experimentally carried out. The heating surface is kept samefor the comparative study of the plate and pin fins. The results show that the pin micro-fins can be preferred overplate micro-fins as they have better thermal properties like higher value for heat transfer coefficient and lower forthermal resistances, by incorporating minimum material. Thereby the total weight of the pin fin is reduced andimprovements in the thermal characteristics can be achieved. The upward facing and downward facing effect onthe thermal characteristics is also studied.

Kundlik Vitthal Mali

School of Mechanical Engineering

Engineering and Technology

Dnyaneshwar Bhadre

MIT-World Peace University (MIT-WPU) is a top educational institute located in Pune, India. It is recognized within&nbsp;UGC under Government of Maharashtra Act No. XXXV 2017.&nbsp;

It is part of the MIT group of institutions (established in 1983) which covers 10+ campuses across India and has more than 50,000+ students enrolled across various disciplines at a given point of time. The institute houses 15 schools ranging from Engineering &amp; Technology, Design, Pharmacy, Commerce, Governance among others. It offers undergraduate, postgraduate and PhD programs among different disciplines.&nbsp;

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MIT World Peace University

International Journal for Research in Engineering Application & Management

The presentwork analyses, for the first time, the heat transfer frompin micro-fins. The scope of the present paper is comparing thermal performance of plate micro-fin and pin micro-fin arrays under natural convection conditionsin air.Two fin geometries are considered: plate and pin fin arrayswith the same thermal exchanging surfaceare tested. The investigation shows that the pin micro-fins can improve the thermal performance compared toplate micro-fin arrays. Indeed, pin micro-fins are found to have higher heat transfer coefficients and lower thermalresistances, as well as a better material usage. This makes pin micro-fins able to achieve both thermal enhancementand weight reduction than plate micro-fins. The radiative heat transfer is also calculated: A new model to determine the radiative view factors of pin fins is proposed and is used in the analysis. The effect of the orientation is considered as well. © 2016 The Authors. Published by Elsevier Ltd.

Fulltext

International Communications in Heat and Mass Transfer

Experimental comparison of micro-scaled plate-fins and pin-fins under natural convection

In recent times, the micro-technologies have gained prominence in various engineering applications. The micro-technologies are already in use for cooling purposes in several systems, but the information on the thermal performance of micro-fins under natural convective heat transfer conditions is yet limited. The correlations between heat transfer coefficients and fin geometry have already been investigated, but are not sufficient to optimize the design of the micro-finned arrays. For this reason, the present investigation gives an overview of micro-fins behavior taking into account, for the first time, different heat sink metrics: the fin effectiveness and the mass specific heat transfer coefficient. The results of an original experimental investigation are merged with the data available in literature. Natural convective micro-fins are able to achieve overall fin effectivenesses higher than 1.1. Even if not always beneficial in terms of heat transfer, micro-fins are found always positive in terms of the material usage. In this light, micro-fins can be considered advantageous in those applications that require a minimized weight of the heat sinks. Moreover, a limited effect due to the orientation is observed. © 2016 The Authors. Published by Elsevier Ltd.

Applied Thermal Engineering

Thermal effectiveness and mass usage of horizontal micro-fins under natural convection

International Journal of Heat and Mass Transfer

Comparison of thermal performance between plate-fin and pin-fin heat sinks in natural convection

The raise in temperature is a non-negligible issue for concentrating photovoltaics (CPV), where the sunlight is concentrated up to thousands of times and a large amount of heat is collected on the solar cells. Micro-fins have been identified as one of the most promising solution for CPV cooling: despite its potentials, the number of publications on this subject is still limited. The present paper resumes the state-of-the-art of the research on micro-fins, in order to identify the most convenient fin geometry for CPV applications. The results of the investigation conducted in this work show that, compared to a conventional heat sink, micro-fins can improve the thermal performance and, at the same time, lower the weight of a system. For this reason, they are particularly beneficial for tracked systems, such as CPV, where a reduced weight means a reduced load for the tracker. The heat transfer coefficients measured through an experimental setup are used to predict the performance of a micro-finned CPV system in natural convection: an optimized fin array is found able to enhance the mass specific power up to 50% compared to an unfinned surface. © 2015 The Authors. Published by Elsevier Ltd.

Energy Procedia

Plate micro-fins in natural convection: An opportunity for passive concentrating photovoltaic cooling

The interest in micro-technologies has increased in the last decades, because of the low volumes and high performance granted by their application. Micro-fins can find application in several fields, such as power electronics, concentrating photovoltaics and LED. Although micro-technologies have been widely applied in cooling, there is still a lack of knowledge on the thermal behavior of micro-finned heat sinks under natural convective conditions. In the present study, the correspondences between fin geometries and heat transfer coefficients, as well as the effects of the orientation, are experimentally investigated using silicon micro-finned heat sinks with different geometries. The heat sinks are made of 5 cm × 5 cm squared silicon wafer and the fin height ranges between 0.6 mm and 0.8 mm, the spacing between 0.2 mm and 0.8 mm and the thickness between 0.2 and 0.8 mm. Power loads higher than those considered in previous works are studied. The experimental setup is validated using a software simulation and the Nusselt number correlation available in literature. The influence of the fin thickness on this parameter is analyzed and a modified correlation is proposed. Also, the effect of the radiative heat exchange on the overall heat transfer is considered and commented. An analysis of the uncertainty is conducted and reported too. © 2015 Elsevier Ltd. All rights reserved.

Journal	International Journal for Research in Engineering Application & Management
Publisher	IJREAM
Open Access	0